CMB-S4 Cosmic Microwave Background Stage 4 WBS LVL 2 Detector and Readout Gunther Haller, SLAC for the detector and readout team Kent Irwin, SLAC/Stanford University Clarence Chang, ANL Adrian Lee, LBNL Gunther Haller, SLAC Chris Bebek, LBNL Jim Kerby, ANL (with a lot of help from Zeesh Ahmed and Sherry Cho, SLAC) September 8, 2018 Princeton University
Intro/Disclaimer Cost estimate is bottoms up (~200 activities) • Needs more checking/review, especially production fab and test effort Needed to make several assumptions • Reviewed document specifying requirements for detector & readout would be helpful Workbook uses excel constants in activities (e.g. types and number of detector wafers), so changes should easily flow down to cost of activities Contingency factors need to be revisited Labor categories used for now are only electrical engineer, tech, scientist (needs work, also need to add fabrication engineer) In general labor rates sheet used for detector & readout are too low, need adjusting? ($150 engineer fully loaded) 2
System Diagram and L3 W.B.S. 1.5.3 Cold Electronics
1.5.2 Cryo Electronics 100 mK
Horn OptoCoupling Array
Detect or Wafer
~64x32 ~64x32 channels channels
Nyqui st Filter carrier With ~64 32channel filter chips
1K
Mux Carri er
Connect or
Cold Cable With ~64 32channel mux chips
Definition: Detector channels means TES channels ~1,600 average TES channels per detector module assembly, depending on band Internally connected via wire bonds (2 TES channels per polarimeter frequency)
4K
1.5.4 Warm Electronics
300 K
40K
Magnetic Shield Amplifi er SQUID PCB
100mK-to-4K cable: Heat sunk at 1 K Out: 64 pairs Row select 32 pairs Feedback 64 pairs DetBias: 64 pairs = 224 pairs
Woven cable
Warm Preamp Card
4k-to-300K cable: Heat sunk at 40 K Out: 64 pairs Row select 32 pairs Feedback 64 pairs DetBias: 64 pairs 4K amplifier Series array feedback: 64 pairs = 288 pairs
plus 1.5.1 Management 1.5.5: System String Test
Twisted Pair readout cable
Readout Crate Readout card(s) with Readout, Address, Bias, communication blocks ~2k channels/ set
To DAQ (CMD, Data, Clock, Timing)
GPS synced, time-stamped ~100usec accuracy
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W.B.S. Dictionary 1.5.1 Management
1.5.3 Cold Electronics
1.5.2 Cryo Electronics
•
4K Amplifier chip
•
Detector Wafers
•
4K Amplifier PCB, assembly, test
•
100mK Nyquist chips
•
4k mechanical components
•
100mK MUX chips
•
4K to 300K cable
•
Horn Arrays
•
4K Assembly and test
•
100mK Nyquist Filter Silicon carrier board & assembly
1.5.4. Warm Electronics •
Warm Preamp Card with cable
•
100mK MUX Silicon carrier board & assembly
•
Readout Module
•
Mechanical components
•
Readout Crate
•
100mK to 4K cable
•
Warm Electronics Assembly and Test
•
Detector Module Assembly
1.5.5 System Test String Test
•
Detector Modules Testing
(L3 Cryo Electronics could easily be split into several L3’s, see later slide)
4
L3 Cost
BOE TOTALS LABOR ID WBS/Activity
DIRECT
OVERHEAD
NON-LABOR TOTALS
DIRECT
OVERHEAD
TOTALS TOTALS
Labor + Non-Labor
0
CMBs4-1.05 Detectors and Readout
$43,855,077
$19,296,234
$63,151,312
$46,370,633
$7,419,301
$53,789,935
$114,686,680
0
CMBs4-1.05.01 Detectors and Readout Management
$10,488,800
$4,615,072
$15,103,872
$456,000
$72,960
$528,960
$15,632,832
0
CMBs4-1.05.02 Cryo Electronics
$28,661,558
$12,611,086
$41,272,644
$29,510,000
$4,721,600
$34,231,600
$75,504,244
0
CMBs4-1.05.05 Cold Electronics
$1,207,589
$531,339
$1,738,929
$7,109,333
$1,137,493
$8,246,827
$7,731,189
0
CMBs4-1.05.06 Warm Electronics
$2,573,130
$1,132,177
$3,705,307
$9,295,300
$1,487,248
$10,782,548
$14,487,855
0
CMBs4-1.05.06 System Test
$924,000
$406,560
$1,330,560
$0
$0
$0
$1,330,560
Note that labor rates used are too low? So cost estimate might go up
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Assumptions Constants in workbook, so can be modified easily Assumed number of TES channels per wafer type* Detector channels = TES channels 2 TES per polarisation frequency Wafer type 1 (30/40 GHz) Wafer type 2 85/145 GHz Wafer type 3 (95/155 GHz) Wafer type 4 (220/270 GHz)
# of TES's/wafer 300 1,500 1,500 2,500
Assumed numbers of wafers for each type # of wafers Wafer type 1 Wafer type 2 Wafer type 3 Wafer type 4
50 75 75 100
Resulting total number of TES channels per wafer type Wafer type 1 Wafer type 2 Wafer type 3 Wafer type 4 Calculated quantities: Total number of detector wafers Total number of TES's Total number of TES channels per Mux chip (64x64 mux) 125 32-channel chips/wafer Total number of Nyquist filter wafers Total number of Mux wafers Total number of readout module systems (one system per detector assembly) Average TES per detector assembly *Assumed number of Wafer versions: 4 frequencies, small/large apertures,south-pole/ Chile
Total # of TES's 15,000 112,500 112,500 250,000 300 490,000 4,096 120 120 300 1,633 16
6
100mK to 1K cables Calculating Number of 100mK to 1K cables Number of columns/wafer Type 1 (number of TES/32 rounded up) Type 2 Type 3 Type 4
10 47 47 79
Number of wires/wafer Type 1 (2 * (#of columns * 3+32)) Type 2 Type 3 Type 4
124 346 346 538
Number of cables/wafer Type 1 (Number of wires/100 rounded up) Type 2 Type 3 Type 4
2 4 4 6
Number of cables per wafer type Type 1 (multiply by # of wafers) Type 2 Type 3 Type 4 Total number of 100mK to 4K cables
100 300 300 600 1,300
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Amplifier SQUID wafers and carriers Calculating Number of SQUID wafers and carriers Number of SQUID chips and daughter cards Type 1 (#columns x # wafers for each band) Type 2 Type 3 Type 4 Total number of SQUID chips Total number of SQUID wafers (1250 SQUID chips/wafer) Total number of SQUID daughter boards (8 SQUID/board) Number of SQUID carrier cards Type 1 (2 daughter boards each) Type 2 (6 daughter cards each) Type 3 (6 daughter cards each) Type 4 (10 daughter cards each) Total number of carrier cards
500 3,525 3,525 7,900 15,450 13 1,931 50 75 75 100 300 8
4K to 300K cables Calculating Number of 4K to 300K cables Number of Columns/wafer Band 1 (number of TES/32 rounded up) Band 2 Band 3 Band 4 Number of Wires/wafer Band 1 2 * (#of columns * 4+32) Band 2 Band 3 Band 4 Number of Cables/wafer Band 1 (Number of wires/100 rounded up) Band 2 Band 3 Band 4 Number of cables/Band total Band 1 (multiply by # of wafers) Band 2 Band 3 Band 4 Total number of 4K to 300K cables
10 47 47 79 144 440 440 696 2 5 5 7 100 375 375 700 1,550
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W.B.S. and deliverables 1.5.2. Cryo Electronics Detector wafers 100mK Nyquist filter chips 100mK MUX chips Horn arrays 100mK Filter Carrier board 100mK Mux Carrier board Mechanical components 100mK to 4K Detector Cable Detector Module Assembly & Test
SAT and LAT?
1.5.3 Cold Electronics 4K Amplifier chips 4K Amplifier Cold PCB Mechanical components Cold Electronics Assembly & Test 4K to 300K Cable
SAT and LAT?
1.5.4 Warm Electronics Warm Preamp Card Crate cable Readout Modules Readout Crate Crate Assembly & Test
SAT and LAT?
In Blue: Deliverables from L2 Detector and Readout sub-system plus 1.5.1 Management 1.5.5: System Test 10
Detector fabrication reference model Detector fabrication approaches • “Industrial model”: dedicated fab engineer for each tool and process step. • “Hero model”: single, highly skilled fabricator carries multiple wafers quickly through all steps. • For cost and schedule projections, we assume a model that lies between these models, in which a “fabrication team” works together carrying each batch of wafers through all steps. • Multiple national labs have heritage in TES detector fabrication (ANL, LBNL, SLAC, NIST, JPL) in Stage-2 and Stage-3 CMB programs, Submillimeter cameras, SuperCDMS, x-ray spectrometers. Detector production model assumed for reference: • Individual fabrication team: 2 fabrication engineers, carrying 8 wafers through full process, plus witness wafers for destructive in-fab testing. • Careful process (lots of metrology & inspection) takes 2.5 months on average per batch of wafers. • 6 wafers successfully exit fab, passing in-fab metrology. • Post-fab wafer testing takes 1 month. • 4 of these 6 wafers (67%) successfully yield (in-spec on detector parameters)
11
Testing and assembly • All components (apart from detectors) screened at component level • Detector arrays tested dark. Arrays meeting dark specs spot checked . optically. Need to determine how testing coordinates with fabrication • Multiplexer chips screened at 4 K, 100% yield required • Detector assembly modules standardized as much as possible in terms of cryogenic interfaces, f#, electrical connections • Need to determine readout density and number of mechanical/readout assemblies. Details of design depends on pixel count
12
Comments to W.B.S. activity structure In general assume three phases for each component and system • Prototype phase • Pre-Production phase • Production phase Each phase in turn sub-divided into • Design phase • Fabrication phase • Testing phase Can have several iterations in prototype phase (as specified in comment field in workbook) Separate activity for test related NRE for each component/system • Design and build test setup, generate test-procedures 13
Cost/activities BOE TOTALS LABOR ID WBS/Activity
CMBs4-1.05 Detectors and 0 Readout CMBs4-1.05.01 Detectors and 0 Readout Management 1 L2 Management 2 L3 Management 3 Reviews 4 System Engineering 5 Travel 0 CMBs4-1.05.02 Cryo Electronics 6 Detector Wafers 7 100mK Nyquist chips 8 100mK MUX chips 9 Horn Arrays 100mK Nyquist Filter Silicon carrier 10 board & assembly 100mK MUX Silicon carrier board & 11 assembly 12 Mechanical components 13 100mK to 4K cable 14 Detector Module Assembly 15 Detector Modules Testing 0 CMBs4-1.05.05 Cold Electronics 16 4K Amplifier chip 17 4K Amplifier PCB, assembly, test 18 4k mechanical components 19 4K to 300K cable 20 4K Assembly and test 0 CMBs4-1.05.06 Warm Electronics 21 Warm Preamp Card with cable 22 Readout Module 23 Readout Crate Warm Electronics Assembly and 24 Test 0 CMBs4-1.05.06 System Test 25 String Test
DIRECT
OVERHEAD
NON-LABOR TOTALS
DIRECT
OVERHEAD
TOTALS TOTALS
Labor + Non-Labor
$43,855,077 $19,296,234 $63,151,312 $46,370,633
$7,419,301 $53,789,935
$114,686,680
$10,488,800 $4,615,072 $739,200 $325,248.00 $7,718,480 $3,396,131.20 $1,384,320 $609,100.80 $646,800 $284,592.00 $0 $0.00 $28,661,558 $12,611,086 $16,301,391 $7,172,611.94 $5,410,477 $2,380,609.85 $1,874,480 $824,771.39 $413,837 $182,088.25
$72,960 $528,960 $0 $0 $1,280 $9,280 $0 $0 $0 $0 $71,680 $519,680 $4,721,600 $34,231,600 $1,400,000 $10,150,000 $144,000 $1,044,000 $672,000 $4,872,000 $763,200 $5,533,200
$15,632,832 $1,064,448 $11,123,891 $1,993,421 $931,392 $519,680 $75,504,244 $33,624,003 $8,835,087 $7,571,252 $6,129,125
$15,103,872 $456,000 $1,064,448 $0 $11,114,611 $8,000 $1,993,421 $0 $931,392 $0 $0 $448,000 $41,272,644 $29,510,000 $23,474,003 $8,750,000 $7,791,087 $900,000 $2,699,252 $4,200,000 $595,925 $4,770,000
$473,681 $208,419.54
$682,100
$1,420,000
$695,127 $305,855.85 $234,319 $103,100.39 $33,047 $14,540.46 $96,800 $42,592.00 $3,128,400 $1,376,496.00 $1,207,589 $531,339 $781,225 $343,739.00 $107,644 $47,363.34 $101,356 $44,596.50 $91,721 $40,357.09 $125,644 $55,283.34 $2,573,130 $1,132,177 $166,725 $73,358.97 $2,125,403 $935,177.35 $82,402 $36,256.81
$1,000,983 $337,419 $47,587 $139,392 $4,504,896 $1,738,929 $1,124,964 $155,007 $145,952 $132,078 $180,927 $3,705,307 $240,084 $3,060,580 $118,659
$1,420,000 $1,390,000 $2,660,000 $0 $4,000,000 $7,109,333 $1,033,333 $56,000 $1,240,000 $4,710,000 $70,000 $9,295,300 $765,000 $6,420,300 $2,110,000
$198,600 $87,384.00 $924,000 $406,560 $924,000 $406,560.00
$285,984 $1,330,560 $1,330,560
$0 $0 $0
$227,200
$1,647,200
$2,329,300
$227,200 $1,647,200 $222,400 $1,612,400 $425,600 $3,085,600 $0 $0 $640,000 $4,640,000 $1,137,493 $8,246,827 $165,333 $1,198,667 $8,960 $64,960 $198,400 $1,438,400 $753,600 $5,463,600 $11,200 $81,200 $1,487,248 $10,782,548 $122,400 $887,400 $1,027,248 $7,447,548 $337,600 $2,447,600
$2,648,183 $1,949,819 $3,133,187 $139,392 $9,144,896 $7,731,189 $2,323,631 $219,967 $1,584,352 $5,595,678 $262,127 $14,487,855 $1,127,484 $10,508,128 $2,566,259
$0 $0 $0
$0 $0 $0
$285,984 $1,330,560 $1,330,560
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W.B.S structure considerations (and cost drivers) L3 Cryo W.B.S. is pretty large compared to others •
$77M out of $114M before contingency
Might consider splitting Cryo into several L3’s, candidates •
Detector Wafers: $33M
•
100mK chips: $16M
•
Horn Arrays: $6M
•
Cryo Assemblies (receiving above deliverables): $10M
•
Detector Module Testing: $9 M
•
100mk to 4K cable: $3M
Relatively easy to modify work-book. Not important at this stage of the project (cost should be the same), but when L3 management and tracking of cost/schedule variances are to be considered Cold Electronics cost drivers: •
4K to 300K cable: $5.5M
Warm Electronics cost driver: •
Readout Module Electronics: $10.5M
15
Schedule Assumes 7 year project duration • Did not put much effort into schedule yet Still need better determine what the start and end dates are for assemblies to be delivered
• Technology driven schedule, dates will then be modified Need to make some decisions (asap, dates tbd)
• Number of detectors on each wafers at each frequency
16
Interfaces to other sub-systems CMD/Data/CLK/Timing/Control • Optical (Fibers) -> SAT/LAT? • Protocol (DAQ) Mechanical/Thermal SAT and LAT Sub-System ?
Detectors and Readout Sub-System
DAQ Sub-System
Power • AC Power SAT and LAT Sub-System ?
Deliverables, assembly
Space • for warm electronics crates/racks
Site Sub-System or SAT/LAT
Site Sub-System or SAT/LAT
17
Comments to scope Horn Testing • Only mechanical design and metrology included in Detector and Readout sub-system scope 4K to 300K cable •
Might consider to move to SAT/LAT sub-system
18