AP

AP.10H.01 Specification Part No. AP.10H.01 Product Name 10mm SMT 25dB Active GPS Patch Antenna With Front End Saw F...

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AP.10H.01

Specification

Part No.

AP.10H.01

Product Name

10mm SMT 25dB Active GPS Patch Antenna With Front End Saw Filter

Feature

Unique SMT GPS active patch Wide Input Voltage 1.8V to 5.5V Ultra low power consumption RoHS compliant

SPE-11-8-101/E/SS |

page 1 of 12

1. Introduction

The AP.10H.01 two stage 25dB active GPS patch antenna is the smallest SMT GPS high performance embedded antenna currently available in the world. Using extremely sensitive high dielectric constant powder formulation and tight process control the 10mm x 10mm x 4mm patch antenna is accurately tuned to have

its frequency band right at 1575.42MHz for GPS systems. A patented SMT structure gives high reliability in integration. With an ultra low power consumption two stage LNA with Saw Filter , this small active patch has the performance of an ordinary active

patch, but at only a quarter of the size. This product is suited to small form factor mobile devices such as GPS Smartphones, Personal Location, Medical devices, Telematic devices and Automotive navigation and tracking. Custom gain, connector and cable versions are available.

The AP.10H consists of 2 functional blocks – the LNA and also the patch antenna.

ANTENNA

SAW Filter

LNA*2

SPE-11-8-101/E/SS |

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2. Specification 2.1 Patch Antenna Parameter

Specification

Frequency

1575.42 ± 1.023MHz

Gain

Typ -10dBic @ Zenith

Impedance

50Ω

Polarization

RHCP

Axial Ratio

Max 4.0dB @ Zenith

Dimension

10mm x 10mm x 4mm (add 7.3mm depth for vertical PCB)

2.2 LNA Parameter

Specification

Frequency Outer Band Attenuation

1575.42 ± 1.023MHz F0=1575.42MHz F0±30MHz

5dB min.

F0±50MHz

20dB min.

F0±100MHz Output Impedance

50Ω

Output VSWR

2.0 Max Min. 8dBm Typ. 11dBm

Pout at 1dB Gain Compression point

25dB min.

LNA Gain, Power Consumption and Noise Figure Voltage

LNA Gain (Typ)

Power Consumption(mA) Typ

Noise Figure Typ

Min. 1.8V

20dB

5mA

2.7dB

Typ. 3.0V

25dB

10mA

2.5dB

Max. 5.5V

25dB

23mA

2.7dB

Input Voltage

Min. 1.8V

Typ. 3.0V

Max. 5.5V

2.3 Connection Connection

SMT via solder pads

SPE-11-8-101/E/SS |

page 3 of 12

3. LNA Gain and Out Band Rejection @3.0V

1 Active Ch/Trace 2 Response 3 Stimulus 4 Mkr/Analysis 5 Instr State

Tr1 S21 60.00

Log Mag 10.00dB/ Ref -40.00dB (F2) >1 1.5754200 GHz 27.754 dB

50.00 40.00 1

30.00 20.00 3 10.00 0.000

2

-10.00 5

-20.00

1 7

-30.00

6 4

-40.00

1 Center 1.57542 GHz

Cg1 Cg1 Cg1 Cg1 Cg1 Cg1 Cg1

Tr1 Tr1 Tr1 Tr1 Tr1 Tr1 Tr1

S21 S21 S21 S21 S21 S21 S21

>1 2 3 4 5 6 7

IFBW 70 kHz

1.5754200 1.6054200 1.5454200 1.6254200 1.5254200 1.6754200 1.4754200

GHz GHz GHz GHz GHz GHz GHz

27.754 - 2.2291 20.458 - 32.691 - 10.283 - 23.132 - 21.485

Span 400 MHz 19/20 Cor

dB dB dB dB dB dB dB

SPE-11-8-101/E/SS |

page 4 of 12

4. LNA Noise Figure @3.0V

Mkr1

1.5754 GHz

2.558 dB

27.557 dB

9.000 NFIG Scale/ 1.000 dB

1

-1.000 40.00

1

GAIN Scale/ 5.000 dB -10.00

Center 1.57542 GHz BW 4 MHz Tcold 296.50 K Avgs Off

Points 11 Att 0/ - - dB

Span 3.00 MHz Loss Off Corr

5. Total Specification (through Antenna, LNA) Parameter

Specification

Frequency

1575.42 ± 1.023MHz

Gain @ 3.0V

15 ± 4dBic @ 90°

Output Impedance

50Ω

Polarization

RHCP

Output VSWR

Max 2.0

Operation Temperature

-40°C to + 85°C

Storage Temperature

-40°C to + 85°C

Relative Humidity

40% to 95%

Input Voltage

Min. 1.8V, Typ. 3.0V, Max. 5.5V

ESD Capability

Direct Discharge: 4KV Min.

SPE-11-8-101/E/SS |

page 5 of 12

6. Radiation Patterns 6.1 XZ Plane 0 -8 -10

-15

-20

-25

-30

-35

90

270

-40

180

Pattern Model No. Test Mode Freq (MHz) Max Gain(dBi) Min Gain(dBi) 1

AP.10H.01

XZ

1620.00

-9.20 / 42.00

-11.99 / 147.00

Avg. Gain(dBi) Source Polar. -10.24

RHCP

Date 2010/4/29

SPE-11-8-101/E/SS |

page 6 of 12

6.2 YZ Plane

0 -8 -10

-15

-20

-25

-30

-35

90

270

-40

180

Pattern Model No. Test Mode Freq (MHz) Max Gain(dBi) Min Gain(dBi) 1

AP.10H.01

YZ

1620.00

-9.73 / 324.00 -19.18 / 222.00

Avg. Gain(dBi) Source Polar. -12.80

RHCP

Date 2010/4/29

SPE-11-8-101/E/SS |

page 7 of 12

6.3 XY Plane

0 -8 -10

-15

-20

-25

-30

-35

90

270

-40

180

Pattern Model No. Test Mode Freq (MHz) Max Gain(dBi) Min Gain(dBi)

Avg. Gain(dBi) Source Polar.

Date

1

AP.10H.01

XZ

1620.00

-9.20 / 42.00

-11.99 / 147.00

-10.24

RHCP

2010/4/29

2

AP.10H.01

YZ

1620.00

-9.73 / 324.00 -19.18 / 222.00

-12.80

RHCP

2010/4/29

SPE-11-8-101/E/SS |

page 8 of 12

ALL

Initial Design

Kiwi

2011/9/29

B

F5

Add logo+P/N on the patch

Kiwi

2011/11/9

C

G3

Amend drawing content

Sandy

2011/11/16

AP.10G.01

A

7. Technical Drawing

A

B

w

ALL

Kiwi

Initial Design

2011/11/9

AP.10H.01

Top View

Side View

iew

PCB Footprint

Bottom View

sembly

Back

Side

PCB Footprint

Application Assembly Front

Ground PCB Thickness 0.8mm

Material NameP/N 10mmx4.2mm) AP.10G Ceramic 1 Patch (10mm x 10mm x 4.2mm)

e

Back

Side

Name

Note: QTY P/NFinish Material Finish QTY 1.Soldered Area Clear 1 AP.10H Ceramic Clear 1

2.Solder Mask Area(Green)

2

Shielding Case

Tin (SPTE)

Tin Plated Tin1(SPTE)3.Clearance Tin PlatedArea1

3

PCB

FR4 0.6t

Green

Name

P/N

1

Patch (10mmx10mmx4.2mm)

2

Shielding Case

3

PCB

AP.10H

4.Shielding Case Area

FR41 0.6t Green 1 to be solder (Pad) Ground5.Area PCB Thickness 0.8mm

NOTE: 1. Soldered area 2. Solder Mask Area (Green) 3. Clearance Area 4. Shielding Case Area 5. Area to be solder (Pad)

Note: 1.Soldered Area Ceramic Clear 1 2.Solder Mask Area(Green) TW Design Centre This drawing and its inherent design concepts are property of3.Clearance Taoglas. Not to Area Tin Plated Tin (SPTE) 1 be copied or given to third parties without the written consent of Taoglas. 4.Shielding Case Area FR4 0.6t Green 1 5.Area to be solder (Pad) Material

Finish

QTY

SPE-11-8-101/E/SS | TW Design Centre This drawing and its inherent design concepts are property of Taoglas. Not to

page 9 of 12

View A

ALL

Initial Design

Kiwi

B

F5

Add logo+P/N on the patch

Kiwi

C

G3

Amend drawing content

Sandy

A

ALL

2011/9/29

Kiwi

Initial Design

2011/11/9 2011/11/16

AP.10G.01

AP.10H.01

Top View

m View

7.1 PCB Footprint B

Side View

w

PCB Footprint

n Assembly Back

Side

Bottom View

iew

Ground PCB Thickness 0.8mm Name

P/N

mmx10mmx4.2mm)

AP.10H

Material

Case

Finish

Note: 1.Soldered Area 2.Solder Mask Area(Green) 3.Clearance Area 4.Shielding Case Area 5.Area to be solder (Pad)

QTY

Ceramic

Clear

1

Tin (SPTE)

Tin Plated

1

FR4 0.6t

Green

1

PCB Footprint

Application Assembly PCB Footprint Front

Back

Side

TW Design Centre This drawing and its inherent design concepts are property of Taoglas. Not to be copied or given to third parties without the written consent of Taoglas.

sembly Back

Side

Ground PCB Thickness 0.8mm Name Patch (10mmx10mmx4.2mm)

2

Shielding Case

PCB Ground PCB3 Thickness 0.8mm

Material NameP/N 10mmx4.2mm) AP.10G Ceramic 1 Patch (10mm x 10mm x 4.2mm)

e

1

Name

2

Shielding Case

Tin (SPTE)

3

PCB

FR4 0.6t

P/N AP.10H

Material

Finish

QTY

Ceramic

Clear

1

Tin (SPTE)

Tin Plated

1

Green

1

FR4 0.6t

Note: QTY P/NFinish Material Finish QTY 1.Soldered Area Clear 1 AP.10H Ceramic Clear 1 2.Solder Mask Area(Green) Tin Plated Tin1(SPTE)3.Clearance Tin PlatedArea1 4.Shielding Case Area FR41 0.6t Green 1 Green 5.Area to be solder (Pad)

Note: 1.Soldered Area 2.Solder Mask Area(Gr 3.Clearance Area 4.Shielding Case Area 5.Area to be solder (Pa

NOTE: 1. Soldered area TW D 2. Solder Mask Area (Green) This drawing and its inherent design concepts are property o be copied or given to third parties without the written conse 3. Clearance Area 4. Shielding Case Area 5. Area to be solder (Pad)

TW Design Centre This drawing and its inherent design concepts are property of Taoglas. Not to be copied or given to third parties without the written consent of Taoglas.

SPE-11-8-101/E/SS | page 10 of 12

8. Recommended Reflow Soldering Profile AP.10H can be assembled following Pb-free assembly. According to the Standard IPC/JEDEC J-STD-020C, the temperature profile suggested is as follows: Phase

Profile Features

Pb-Free Assembly (SnAgCu)

PREHEAT

Temperature Min(Tsmin) Temperature Max(Tsmax) Time(ts) from (Tsmin to Tsmax)

150°C 200°C 60-120 seconds

RAMP-UP

Avg. Ramp-up Rate (Tsmax to TP)

3°C/second(max)

REFLOW

Temperature(TL) Total Time above TL (tL)

217°C 30-100 seconds

PEAK

Temperature (TP) Time (tp)

260°C 2-5 seconds

RAMP-DOWN

Rate

3°C/second(max)

Time from 25°C to Peak Temperature

8 minutes max.

Composition of solder paste

96.5Sn/3Ag/0.5Cu

Solder Paste Model

SHENMAO PF606-P26

The graphic shows temperature profile for component assembly process in reflow ovens

Tp tP

Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s

Temperature

TL Tsmax

Tc -5°C

tL

Preheat Area

Tsmin ts

25 Time 25°C to Peak Time Soldering Iron condition: Soldering iron temperature 270°C±10°C. Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron temperature over 270°C±10°C or 3 seconds, it will make cause component surface peeling or damage.

SPE-11-8-101/E/SS | page 11 of 12

8.0 Packaging Packaged on Tape and Reel – 250 pieces per reel Each Reel is packaged – Inner Carton Outer Carton contains 5 Reels – 1250 pieces per Carton

9. Packaging

Packaged on Tape and Reel

250 pieces per reel

Each Reel is packaged

Inner Carton

Outer Carton contains 5 Reels

1250 pieces per Carton

Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and

SPE-11-8-101/C/SS

product descriptions at any time without notice. Taoglas reserves all rights to this document and the information contained herein.

Reproduction, use or disclosure to third parties without express permission is strictly prohibited. Copyright © Taoglas Ltd.

SPE-11-8-101/E/SS | page Page 11 12 of of1112