AP.10H.01
Specification
Part No.
AP.10H.01
Product Name
10mm SMT 25dB Active GPS Patch Antenna With Front End Saw Filter
Feature
Unique SMT GPS active patch Wide Input Voltage 1.8V to 5.5V Ultra low power consumption RoHS compliant
SPE-11-8-101/E/SS |
page 1 of 12
1. Introduction
The AP.10H.01 two stage 25dB active GPS patch antenna is the smallest SMT GPS high performance embedded antenna currently available in the world. Using extremely sensitive high dielectric constant powder formulation and tight process control the 10mm x 10mm x 4mm patch antenna is accurately tuned to have
its frequency band right at 1575.42MHz for GPS systems. A patented SMT structure gives high reliability in integration. With an ultra low power consumption two stage LNA with Saw Filter , this small active patch has the performance of an ordinary active
patch, but at only a quarter of the size. This product is suited to small form factor mobile devices such as GPS Smartphones, Personal Location, Medical devices, Telematic devices and Automotive navigation and tracking. Custom gain, connector and cable versions are available.
The AP.10H consists of 2 functional blocks – the LNA and also the patch antenna.
ANTENNA
SAW Filter
LNA*2
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2. Specification 2.1 Patch Antenna Parameter
Specification
Frequency
1575.42 ± 1.023MHz
Gain
Typ -10dBic @ Zenith
Impedance
50Ω
Polarization
RHCP
Axial Ratio
Max 4.0dB @ Zenith
Dimension
10mm x 10mm x 4mm (add 7.3mm depth for vertical PCB)
2.2 LNA Parameter
Specification
Frequency Outer Band Attenuation
1575.42 ± 1.023MHz F0=1575.42MHz F0±30MHz
5dB min.
F0±50MHz
20dB min.
F0±100MHz Output Impedance
50Ω
Output VSWR
2.0 Max Min. 8dBm Typ. 11dBm
Pout at 1dB Gain Compression point
25dB min.
LNA Gain, Power Consumption and Noise Figure Voltage
LNA Gain (Typ)
Power Consumption(mA) Typ
Noise Figure Typ
Min. 1.8V
20dB
5mA
2.7dB
Typ. 3.0V
25dB
10mA
2.5dB
Max. 5.5V
25dB
23mA
2.7dB
Input Voltage
Min. 1.8V
Typ. 3.0V
Max. 5.5V
2.3 Connection Connection
SMT via solder pads
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3. LNA Gain and Out Band Rejection @3.0V
1 Active Ch/Trace 2 Response 3 Stimulus 4 Mkr/Analysis 5 Instr State
Tr1 S21 60.00
Log Mag 10.00dB/ Ref -40.00dB (F2) >1 1.5754200 GHz 27.754 dB
50.00 40.00 1
30.00 20.00 3 10.00 0.000
2
-10.00 5
-20.00
1 7
-30.00
6 4
-40.00
1 Center 1.57542 GHz
Cg1 Cg1 Cg1 Cg1 Cg1 Cg1 Cg1
Tr1 Tr1 Tr1 Tr1 Tr1 Tr1 Tr1
S21 S21 S21 S21 S21 S21 S21
>1 2 3 4 5 6 7
IFBW 70 kHz
1.5754200 1.6054200 1.5454200 1.6254200 1.5254200 1.6754200 1.4754200
GHz GHz GHz GHz GHz GHz GHz
27.754 - 2.2291 20.458 - 32.691 - 10.283 - 23.132 - 21.485
Span 400 MHz 19/20 Cor
dB dB dB dB dB dB dB
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4. LNA Noise Figure @3.0V
Mkr1
1.5754 GHz
2.558 dB
27.557 dB
9.000 NFIG Scale/ 1.000 dB
1
-1.000 40.00
1
GAIN Scale/ 5.000 dB -10.00
Center 1.57542 GHz BW 4 MHz Tcold 296.50 K Avgs Off
Points 11 Att 0/ - - dB
Span 3.00 MHz Loss Off Corr
5. Total Specification (through Antenna, LNA) Parameter
Specification
Frequency
1575.42 ± 1.023MHz
Gain @ 3.0V
15 ± 4dBic @ 90°
Output Impedance
50Ω
Polarization
RHCP
Output VSWR
Max 2.0
Operation Temperature
-40°C to + 85°C
Storage Temperature
-40°C to + 85°C
Relative Humidity
40% to 95%
Input Voltage
Min. 1.8V, Typ. 3.0V, Max. 5.5V
ESD Capability
Direct Discharge: 4KV Min.
SPE-11-8-101/E/SS |
page 5 of 12
6. Radiation Patterns 6.1 XZ Plane 0 -8 -10
-15
-20
-25
-30
-35
90
270
-40
180
Pattern Model No. Test Mode Freq (MHz) Max Gain(dBi) Min Gain(dBi) 1
AP.10H.01
XZ
1620.00
-9.20 / 42.00
-11.99 / 147.00
Avg. Gain(dBi) Source Polar. -10.24
RHCP
Date 2010/4/29
SPE-11-8-101/E/SS |
page 6 of 12
6.2 YZ Plane
0 -8 -10
-15
-20
-25
-30
-35
90
270
-40
180
Pattern Model No. Test Mode Freq (MHz) Max Gain(dBi) Min Gain(dBi) 1
AP.10H.01
YZ
1620.00
-9.73 / 324.00 -19.18 / 222.00
Avg. Gain(dBi) Source Polar. -12.80
RHCP
Date 2010/4/29
SPE-11-8-101/E/SS |
page 7 of 12
6.3 XY Plane
0 -8 -10
-15
-20
-25
-30
-35
90
270
-40
180
Pattern Model No. Test Mode Freq (MHz) Max Gain(dBi) Min Gain(dBi)
Avg. Gain(dBi) Source Polar.
Date
1
AP.10H.01
XZ
1620.00
-9.20 / 42.00
-11.99 / 147.00
-10.24
RHCP
2010/4/29
2
AP.10H.01
YZ
1620.00
-9.73 / 324.00 -19.18 / 222.00
-12.80
RHCP
2010/4/29
SPE-11-8-101/E/SS |
page 8 of 12
ALL
Initial Design
Kiwi
2011/9/29
B
F5
Add logo+P/N on the patch
Kiwi
2011/11/9
C
G3
Amend drawing content
Sandy
2011/11/16
AP.10G.01
A
7. Technical Drawing
A
B
w
ALL
Kiwi
Initial Design
2011/11/9
AP.10H.01
Top View
Side View
iew
PCB Footprint
Bottom View
sembly
Back
Side
PCB Footprint
Application Assembly Front
Ground PCB Thickness 0.8mm
Material NameP/N 10mmx4.2mm) AP.10G Ceramic 1 Patch (10mm x 10mm x 4.2mm)
e
Back
Side
Name
Note: QTY P/NFinish Material Finish QTY 1.Soldered Area Clear 1 AP.10H Ceramic Clear 1
2.Solder Mask Area(Green)
2
Shielding Case
Tin (SPTE)
Tin Plated Tin1(SPTE)3.Clearance Tin PlatedArea1
3
PCB
FR4 0.6t
Green
Name
P/N
1
Patch (10mmx10mmx4.2mm)
2
Shielding Case
3
PCB
AP.10H
4.Shielding Case Area
FR41 0.6t Green 1 to be solder (Pad) Ground5.Area PCB Thickness 0.8mm
NOTE: 1. Soldered area 2. Solder Mask Area (Green) 3. Clearance Area 4. Shielding Case Area 5. Area to be solder (Pad)
Note: 1.Soldered Area Ceramic Clear 1 2.Solder Mask Area(Green) TW Design Centre This drawing and its inherent design concepts are property of3.Clearance Taoglas. Not to Area Tin Plated Tin (SPTE) 1 be copied or given to third parties without the written consent of Taoglas. 4.Shielding Case Area FR4 0.6t Green 1 5.Area to be solder (Pad) Material
Finish
QTY
SPE-11-8-101/E/SS | TW Design Centre This drawing and its inherent design concepts are property of Taoglas. Not to
page 9 of 12
View A
ALL
Initial Design
Kiwi
B
F5
Add logo+P/N on the patch
Kiwi
C
G3
Amend drawing content
Sandy
A
ALL
2011/9/29
Kiwi
Initial Design
2011/11/9 2011/11/16
AP.10G.01
AP.10H.01
Top View
m View
7.1 PCB Footprint B
Side View
w
PCB Footprint
n Assembly Back
Side
Bottom View
iew
Ground PCB Thickness 0.8mm Name
P/N
mmx10mmx4.2mm)
AP.10H
Material
Case
Finish
Note: 1.Soldered Area 2.Solder Mask Area(Green) 3.Clearance Area 4.Shielding Case Area 5.Area to be solder (Pad)
QTY
Ceramic
Clear
1
Tin (SPTE)
Tin Plated
1
FR4 0.6t
Green
1
PCB Footprint
Application Assembly PCB Footprint Front
Back
Side
TW Design Centre This drawing and its inherent design concepts are property of Taoglas. Not to be copied or given to third parties without the written consent of Taoglas.
sembly Back
Side
Ground PCB Thickness 0.8mm Name Patch (10mmx10mmx4.2mm)
2
Shielding Case
PCB Ground PCB3 Thickness 0.8mm
Material NameP/N 10mmx4.2mm) AP.10G Ceramic 1 Patch (10mm x 10mm x 4.2mm)
e
1
Name
2
Shielding Case
Tin (SPTE)
3
PCB
FR4 0.6t
P/N AP.10H
Material
Finish
QTY
Ceramic
Clear
1
Tin (SPTE)
Tin Plated
1
Green
1
FR4 0.6t
Note: QTY P/NFinish Material Finish QTY 1.Soldered Area Clear 1 AP.10H Ceramic Clear 1 2.Solder Mask Area(Green) Tin Plated Tin1(SPTE)3.Clearance Tin PlatedArea1 4.Shielding Case Area FR41 0.6t Green 1 Green 5.Area to be solder (Pad)
Note: 1.Soldered Area 2.Solder Mask Area(Gr 3.Clearance Area 4.Shielding Case Area 5.Area to be solder (Pa
NOTE: 1. Soldered area TW D 2. Solder Mask Area (Green) This drawing and its inherent design concepts are property o be copied or given to third parties without the written conse 3. Clearance Area 4. Shielding Case Area 5. Area to be solder (Pad)
TW Design Centre This drawing and its inherent design concepts are property of Taoglas. Not to be copied or given to third parties without the written consent of Taoglas.
SPE-11-8-101/E/SS | page 10 of 12
8. Recommended Reflow Soldering Profile AP.10H can be assembled following Pb-free assembly. According to the Standard IPC/JEDEC J-STD-020C, the temperature profile suggested is as follows: Phase
Profile Features
Pb-Free Assembly (SnAgCu)
PREHEAT
Temperature Min(Tsmin) Temperature Max(Tsmax) Time(ts) from (Tsmin to Tsmax)
150°C 200°C 60-120 seconds
RAMP-UP
Avg. Ramp-up Rate (Tsmax to TP)
3°C/second(max)
REFLOW
Temperature(TL) Total Time above TL (tL)
217°C 30-100 seconds
PEAK
Temperature (TP) Time (tp)
260°C 2-5 seconds
RAMP-DOWN
Rate
3°C/second(max)
Time from 25°C to Peak Temperature
8 minutes max.
Composition of solder paste
96.5Sn/3Ag/0.5Cu
Solder Paste Model
SHENMAO PF606-P26
The graphic shows temperature profile for component assembly process in reflow ovens
Tp tP
Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s
Temperature
TL Tsmax
Tc -5°C
tL
Preheat Area
Tsmin ts
25 Time 25°C to Peak Time Soldering Iron condition: Soldering iron temperature 270°C±10°C. Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron temperature over 270°C±10°C or 3 seconds, it will make cause component surface peeling or damage.
SPE-11-8-101/E/SS | page 11 of 12
8.0 Packaging Packaged on Tape and Reel – 250 pieces per reel Each Reel is packaged – Inner Carton Outer Carton contains 5 Reels – 1250 pieces per Carton
9. Packaging
Packaged on Tape and Reel
250 pieces per reel
Each Reel is packaged
Inner Carton
Outer Carton contains 5 Reels
1250 pieces per Carton
Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and
SPE-11-8-101/C/SS
product descriptions at any time without notice. Taoglas reserves all rights to this document and the information contained herein.
Reproduction, use or disclosure to third parties without express permission is strictly prohibited. Copyright © Taoglas Ltd.
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